Getting back on stuffing the buffer board after a long break.
Paste print looks very good, but I got lucky that nothing fine pitch is in the middle. The board was flexing down there leaving paste on top of the stencil.
Biggest board I've ever pasted, also being 1.2 mm thick made things harder.
I'm going to have to get some support under the middle of the board before stuffing the RFSoC which is even bigger and also 1.2 mm.
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