I think I killed the HBM Virtex in getting it off the board. I shouldn't have trusted the thermal camera as much as I did. It was showing 220 C when the device came off but I think it was much higher. The usual cue of the solder melting was obscured by some remains of corner bonding I was unable to remove prior. Some delamination in the package, VCCINT is 0.001 ohms to ground.
That was an unfortunate mistake as I won't get another another of those. Back to the original plan of multiple XCKU5P.
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