Ancestors

Written by Darrell Harmon on 2024-12-22 at 17:59

This is a Xilinx XCKU5P FPGA in the FFVB676 package. It's the only part of 10 that I got from a few Aliexpress sellers for cheap that didn't work. This one appears to have been overheated in a reballing attempt. The substrate is delaminated as can be seen in the cross section.

14 layer HDI PCB. It's built as a 2 layer 1 mm thick board with 6 plies of resin clad copper (no fiberglass) laminated on. This probably went in a lamination press 6 times with laser vias, plating and etching in between.

=> View attached media

=> More informations about this toot | More toots from dlharmon@chaos.social

Toot

Written by Darrell Harmon on 2024-12-22 at 18:17

I forgot to mention that this part had loose decoupling caps rattling around under the heat spreader. They either dropped or tapped it while hot. The part is consistent with Murata LLL1U4D80E435ME22D which is a 4.3 uF 0204.

I'm going to to a little more milling into the substrate and then send the die off to @azonenberg for some imaging.

=> More informations about this toot | More toots from dlharmon@chaos.social

Descendants